TSMC says its most advanced chip packaging tech, CoWoS, is growing at an 80% CAGR as it ramps up capacity; Nvidia has reportedly reserved most of the capacity (Katie Tarasov/CNBC)

Katie Tarasov / CNBC : TSMC says its most advanced chip packaging tech, CoWoS, is growing at an 80% CAGR as it ramps up capacity; Nvidia has reportedly reserved most of the capacity —  An underappreciated step in the chipmaking process is poised to become the next bottleneck for artificial intelligence.

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