The Korea Times
SK hynix on Tuesday revealed its new high bandwidth memory technology iHBM, which embeds a proprietary cooling element inside the HBM package to substantially reduce heat generation in artificial intelligence (AI) computing environments. The company said heat management has become a critical bottleneck as HBM stacks more layers and operates at higher speeds to keep pace with surging AI workload demand. Heat concentration is most acute at the die-to-die physical layer (D2D PHY), the high-speed data interface between the HBM base die and AI processor dies. Controlling power density in that zone has emerged as a key differentiator in next-generation HBM development. iHBM addresses the problem by placing integrated cooling elements (ICE), directly within the D2D PHY area. ICE uses electrically non-conductive but thermally conductive silicon material to form a dedicated heat path inside the package, replacing the indirect routing of heat through core dies used in conventional HBM. SK hynix said the approach lowers thermal resistance by more than 30 percent compared with existing designs and ma
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